DocumentCode
2944557
Title
Perspectives on integrated metrology and wafer-level control
Author
Lensing, Kevin ; Stirton, Broc
Author_Institution
Adv. Micro Devices, Austin
fYear
2007
fDate
15-17 Oct. 2007
Firstpage
1
Lastpage
5
Abstract
In this paper, we will discuss the critical factors that are driving the implementation progress of integrated metrology (IM) and wafer-level advanced process control (APC). We will describe the potential benefits of IM and the engineering roadblocks that have limited the realization of those benefits. Finally, we will describe AMD´s approach to solving the wafer-level control problem by using stand-alone metrology, dynamic wafer sampling, and a bias correction algorithm.
Keywords
electronics industry; process control; semiconductor device manufacture; semiconductor device measurement; wafer level packaging; bias correction algorithm; dynamic wafer sampling; integrated metrology; stand-alone metrology; wafer-level advanced process control; Control systems; Electrical equipment industry; Feedback; Feedforward systems; Manufacturing industries; Metrology; Process control; Sampling methods; Time measurement; Vehicles;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing, 2007. ISSM 2007. International Symposium on
Conference_Location
Santa Clara, CA
ISSN
1523-553X
Print_ISBN
978-1-4244-1142-9
Electronic_ISBN
1523-553X
Type
conf
DOI
10.1109/ISSM.2007.4446829
Filename
4446829
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