Perspectives on integrated metrology and wafer-level control

In this paper, we will discuss the critical factors that are driving the implementation progress of integrated metrology (IM) and wafer-level advanced process control (APC). We will describe the potential benefits of IM and the engineering roadblocks that have limited the realization of those benefits. Finally, we will describe AMD´s approach to solving the wafer-level control problem by using stand-alone metrology, dynamic wafer sampling, and a bias correction algorithm.