Title :
Advanced monitoring method for copper interconnect process
Author :
Ishikawa, Kensuke ; Ando, Toshio ; Ikota, Masami ; Funakoshi, Tomohiro ; Imai, Yasuo ; Watanabe, Kenji ; Miura, Akihiko ; Ohta, Hideo ; Nemoto, Kazunori ; Onozuka, Toshihiko
Author_Institution :
Hitachi Ltd., Tokyo
Abstract :
Stabilizing copper interconnect process is the key for yield and reliability improvement. Forming adequate grains in a copper film is so important to have the stable process, but there is no proper method of monitoring grains in a copper film. We introduce an advanced method of monitoring grain size using scattering light that we call the micro-haze method. We verified the effectiveness of the method by the experimental design and concluded that the method makes it possible to monitor grains in a copper film.
Keywords :
copper; grain size; integrated circuit interconnections; integrated circuit reliability; integrated circuit yield; process monitoring; scattering; copper interconnect process; grain size; micro-haze method; monitoring method; reliability improvement; scattering light; yield improvement; Atomic force microscopy; Copper; Grain size; Light scattering; Manufacturing; Monitoring; Rough surfaces; Surface roughness; Throughput; Transmission electron microscopy;
Conference_Titel :
Semiconductor Manufacturing, 2007. ISSM 2007. International Symposium on
Conference_Location :
Santa Clara, CA
Print_ISBN :
978-1-4244-1142-9
Electronic_ISBN :
1523-553X
DOI :
10.1109/ISSM.2007.4446837
