An ultra-miniaturized transceiver module for Bluetooth applications using 3-D LTCC system-on-package technology

Author

Cho, Yun-Hee ; Kim, Jin-Wan ; Park, Yun-Hwi

Author_Institution

Electro Material and Device Lab, Corporate R&D Institute, Samsung Electro-Mechanics, Suwon, Gyoung Gi, 443-803, Korea

fYear

2008

fDate

15-20 June 2008

Firstpage

1

Lastpage

4

Abstract

In this paper, an ultra miniaturized transceiver module for Bluetooth applications using 3-D LTCC system-on-package technology is presented. The proposed compact LTCC Bluetooth module is monolithically implemented with 0.5 mm thickness substrate embedding all passive components such as bandpass filter, balun, matching circuit, resistor, RF choke and bypass capacitor in order to reduce the overall size of module. The whole size of module is as small as 4.3 times 4.1 times 1.2 mm, which is the smallest size in the Bluetooth modules. The fabricated Bluetooth module reveals a transmit power of over 1 dBm and a sensitivity of -83 dBm.

Keywords

Bluetooth; ceramics; system-on-package; transceivers; 3D LTCC system-on-package technology; Bluetooth applications; RF choke; balun; bandpass filters; bypass capacitor; low temperature cofired ceramics; matching circuit; resistors; size 0.5 mm; ultraminiaturized transceiver module; Band pass filters; Bluetooth; Capacitors; Costs; Impedance matching; Inductors; Integrated circuit noise; Radio frequency; Radiofrequency integrated circuits; Transceivers; Bluetooth; LTCC; embedded;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 2008 IEEE MTT-S International

Conference_Location

Atlanta, GA

ISSN

0149-645X

Print_ISBN

978-1-4244-1780-3

Electronic_ISBN

0149-645X

Type

conf

DOI

10.1109/MWSYM.2008.4633088

Filename

4633088