Highly-integrated dual-band front-end module for WLAN and WiMAX applications based on LTCC technology

Author

Yatsenko, Andriy ; Heyen, Johann ; Sakhnenko, Sergiy ; Vorotnikov, Borys ; Heide, Patric

Author_Institution

EPCOS AG, Product Development Modules, Anzinger Str. 13, D-81617 Munich, Germany

fYear

2008

fDate

15-20 June 2008

Firstpage

13

Lastpage

16

Abstract

A very compact dual-band LTCC module supporting WiMAX IEEE 802.16e-2005 and Wi-Fi IEEE 802.11 a/b/g standards is presented. The frontend module (FEM) integrates in less than 50 mm² all required passive and active functions for 1 times 2 (1 transmit, 2 receive paths) MIMO operability. The FEM package has SMT compatible footprint and is 1.4 mm high. Full FEM measurements results show good performance and fully validate the passive integration approach.

Keywords

IEEE standards; MIMO communication; WiMax; ceramic packaging; transceivers; wireless LAN; IEEE 802.11 a/b/g standard; IEEE 802.16e standard; LTCC technology; MIMO operability; WLAN; WiMAX; highly-integrated dual-band front-end module; low temperature co-fired ceramic module; size 1.4 mm; Ceramics; Dual band; Impedance matching; MIMO; Metallization; Passive filters; Power amplifiers; Surface-mount technology; WiMAX; Wireless LAN; LTCC; WiMax; WirelessLAN; balanced filters; diplexers; module; passive integration; power amplifiers;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 2008 IEEE MTT-S International

Conference_Location

Atlanta, GA

ISSN

0149-645X

Print_ISBN

978-1-4244-1780-3

Electronic_ISBN

0149-645X

Type

conf

DOI

10.1109/MWSYM.2008.4633091

Filename

4633091