DocumentCode :
2944867
Title :
Process start/end event detection and dynamic time warping algorithms for run-by-run process fault detection
Author :
Choi, Ja Young ; Ko, Jong Myoung ; Kim, Chang Ouk ; Kang, Yoon Seong ; Lee, Seung Jun
Author_Institution :
Yonsei Univ., Seoul
fYear :
2007
fDate :
15-17 Oct. 2007
Firstpage :
1
Lastpage :
4
Abstract :
In semiconductor/FPD (flat panel display) manufacturing environments, APC (advanced process control) is a vital task for enhancing yield. The APC technology improves the productivity of equipments based on two main control mechanisms: fault management and R2R (run-to-run) recipe correction. This paper focuses on FDC (fault detection and classification) for the fault management, and proposes a run-by-run process fault detection method. The method consists of a process event detection algorithm to segment process data, and a pattern matching technique to classify the segmented data as normal or abnormal state. Experiments using the data collected from a RIE (reactive ion etching) process show that the proposed method is able to recognize normal/abnormal states with high accuracy.
Keywords :
flat panel displays; pattern matching; sputter etching; advanced process control; dynamic time warping; fault detection and classification; fault management; flat panel display; pattern matching; process start/end event detection; reactive ion etching; recipe correction; run by run process; Event detection; Fault detection; Flat panel displays; Heuristic algorithms; Manufacturing processes; Pattern matching; Process control; Productivity; Semiconductor device manufacture; Technology management;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing, 2007. ISSM 2007. International Symposium on
Conference_Location :
Santa Clara, CA
ISSN :
1523-553X
Print_ISBN :
978-1-4244-1142-9
Electronic_ISBN :
1523-553X
Type :
conf
DOI :
10.1109/ISSM.2007.4446846
Filename :
4446846
Link To Document :
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