EMC Computer Modeling Techniques for CPU Heat Sink Simulation

Author

Lu, J. ; Dawson, F.

Author_Institution

Griffith Univ., Brisbane

fYear

2006

fDate

8-12 May 2006

Firstpage

653

Lastpage

653

Abstract

This paper presents finite element method (FEM) frequency domain results for electromagnetic radiation emitted from high power microelectronic circuits connected to a heat sink. The heat sink model associated with one of the IEEE EMC challenging problems has been used to investigate three different grounding configurations. A new simulation model for the Intel P4 CPU heat sink is proposed and analyzed. A resonant frequency of 2.6 GHz with a reflection coefficient of 8.3 dB was found. This is close to the IEEE and Bluetooth wireless communication system´s operating frequency of 2.4 GHz.

Keywords

Bluetooth; electromagnetic compatibility; electromagnetic waves; finite element analysis; heat sinks; integrated circuit modelling; microprocessor chips; Bluetooth; CPU heat sink; EMC computer modeling; IEEE EMC; Intel P4; electromagnetic radiation; finite element method; frequency 2.4 GHz; frequency 2.6 GHz; frequency domain results; high power microelectronic circuits; wireless communication; Central Processing Unit; Circuit simulation; Computational modeling; Computer simulation; Electromagnetic compatibility; Electromagnetic radiation; Finite element methods; Frequency domain analysis; Heat sinks; Microelectronics;

fLanguage

English

Publisher

ieee

Conference_Titel

Magnetics Conference, 2006. INTERMAG 2006. IEEE International

Conference_Location

San Diego, CA

Print_ISBN

1-4244-1479-2

Type

conf

DOI

10.1109/INTMAG.2006.376377

Filename

4262086