DocumentCode
2945315
Title
Antenna 3D Pad printing solution evaluation
Author
Xiong, Ye ; Qu, Zengchao
Author_Institution
Antenna Div., Foxconn, Beijing, China
fYear
2011
fDate
3-8 July 2011
Firstpage
2773
Lastpage
2776
Abstract
Diversification, styling, miniaturization and cost reduction are trends in the field of portable electronics. The 3D technology is an innovative way to meet this demand. This paper evaluated the Pad printing 3D antenna manufacture technology which offers versatile and cost effective interconnection platform compared to the flex-antenna or sheet metal technologies. The basic Pad Printing process was introduced firstly, the printing ink RF parameter including conductivity, skin depth, inductor loss and radiation efficiency which is important to the antenna performance was analyzed then. A Penta-band mobile phone antenna with same radiator pattern was processed using Pad Printing technology and the common flex antenna technology, their s11 and efficiency was compared with each other. Other parameters including the antenna mechanical, environmental and mass production capacity was evaluated lastly. As a result, the Pad printing manufacture technology has a relatively good potential for antenna mass production application.
Keywords
antenna radiation patterns; microstrip antennas; 3D technology; antenna 3D pad printing solution evaluation; antenna mass production application; antenna mechanical; conductivity; flex antenna technology; inductor loss; interconnection platform; mass production capacity; pad printing 3D antenna manufacture technology; pad printing manufacture technology; pad printing process; pad printing technology; penta-band mobile phone antenna; portable electronics; radiation efficiency; radiator pattern; sheet metal technology; Antenna radiation patterns; Conductivity; Flexible printed circuits; Ink; Printing; Three dimensional displays; 3D Antenna; Ink silver; Integration; Mechanical; Pad Printing;
fLanguage
English
Publisher
ieee
Conference_Titel
Antennas and Propagation (APSURSI), 2011 IEEE International Symposium on
Conference_Location
Spokane, WA
ISSN
1522-3965
Print_ISBN
978-1-4244-9562-7
Type
conf
DOI
10.1109/APS.2011.5997101
Filename
5997101
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