• DocumentCode
    2945315
  • Title

    Antenna 3D Pad printing solution evaluation

  • Author

    Xiong, Ye ; Qu, Zengchao

  • Author_Institution
    Antenna Div., Foxconn, Beijing, China
  • fYear
    2011
  • fDate
    3-8 July 2011
  • Firstpage
    2773
  • Lastpage
    2776
  • Abstract
    Diversification, styling, miniaturization and cost reduction are trends in the field of portable electronics. The 3D technology is an innovative way to meet this demand. This paper evaluated the Pad printing 3D antenna manufacture technology which offers versatile and cost effective interconnection platform compared to the flex-antenna or sheet metal technologies. The basic Pad Printing process was introduced firstly, the printing ink RF parameter including conductivity, skin depth, inductor loss and radiation efficiency which is important to the antenna performance was analyzed then. A Penta-band mobile phone antenna with same radiator pattern was processed using Pad Printing technology and the common flex antenna technology, their s11 and efficiency was compared with each other. Other parameters including the antenna mechanical, environmental and mass production capacity was evaluated lastly. As a result, the Pad printing manufacture technology has a relatively good potential for antenna mass production application.
  • Keywords
    antenna radiation patterns; microstrip antennas; 3D technology; antenna 3D pad printing solution evaluation; antenna mass production application; antenna mechanical; conductivity; flex antenna technology; inductor loss; interconnection platform; mass production capacity; pad printing 3D antenna manufacture technology; pad printing manufacture technology; pad printing process; pad printing technology; penta-band mobile phone antenna; portable electronics; radiation efficiency; radiator pattern; sheet metal technology; Antenna radiation patterns; Conductivity; Flexible printed circuits; Ink; Printing; Three dimensional displays; 3D Antenna; Ink silver; Integration; Mechanical; Pad Printing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation (APSURSI), 2011 IEEE International Symposium on
  • Conference_Location
    Spokane, WA
  • ISSN
    1522-3965
  • Print_ISBN
    978-1-4244-9562-7
  • Type

    conf

  • DOI
    10.1109/APS.2011.5997101
  • Filename
    5997101