Accelerated time-domain modeling of microstrip based microwave circuit geometries on periodic substrates

Advances in the design of electromagnetic bandgap and meta-material structures have opened new possibilities for substrate engineering to optimize the performance of microstrip or coplanar waveguide based integrated microwave circuits. Periodic substrates alone can be fully characterized through their dispersion analysis. On the other hand, modeling the interaction between metallic guides and such substrates usually involves lengthy simulations, because the resulting geometry is non-periodic. We propose a finite-difference time-domain based solution to this problem, which leads to significant acceleration of the relevant modeling process over broad bandwidths, without compromising accuracy.