DocumentCode :
2945738
Title :
An electronics manufacturing minor in engineering with emphasis on rapid prototyping
Author :
Hulina, Paul T. ; Landis, David L.
Author_Institution :
Center for Design & Comput., Pennsylvania State Univ., University Park, PA, USA
fYear :
1997
fDate :
21-23 Jul 1997
Firstpage :
21
Lastpage :
22
Abstract :
This paper describes an Electronics Manufacturing curriculum development project at Penn State. This pilot project is intended to enhance the design and practical experiences of undergraduate engineering students by combining the resources of the Electrical Engineering Department, the Industrial and Manufacturing Engineering Department, and the Center for Electronic Design, Communications, and Computing (CEDCC). The EE Department curriculum and laboratories support electronic circuit design and microelectronic processing, while the IE Department has significant expertise and laboratory facilities in printed circuit board assembly with a strong emphasis on surface mount technology processes. The Center for Electronic Design, Communications, and Compacting (CEDCC) has in place a supporting infrastructure for rapid electronic system design and prototyping which complements both the EE and IE department programs
Keywords :
assembling; circuit CAD; educational courses; electronic engineering education; printed circuit design; printed circuit manufacture; surface mount technology; PCB assembly; Penn State; SMT processes; curriculum development; electronic circuit design; electronics manufacturing minor; microelectronic processing; printed circuit board assembly; rapid electronic system design; rapid prototyping; surface mount technology; undergraduate engineering students; Communication industry; Computer industry; Curriculum development; Design engineering; Electronics industry; Engineering students; Industrial electronics; Laboratories; Manufacturing industries; Pulp manufacturing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronic Systems Education, 1997. MSE '97. Proceedings., 1997 IEEE International Conference on
Conference_Location :
Arlington, VA
Print_ISBN :
0-8186-7996-4
Type :
conf
DOI :
10.1109/MSE.1997.612530
Filename :
612530
Link To Document :
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