Title :
Measurement of effective absorptance on microbolometers
Author :
Ou-Yang, Mang ; Shie, Jin-Shown
Author_Institution :
Precision Instrum. Dev. Center, Nat. Sci. Council, HsinChu, Taiwan
Abstract :
Microbolometers fabricated by micromachining technology are important for uncooled thermal infrared sensing. Sensors with microstructure call improve their thermal behavior effectively, namely, faster responses and better sensitivities. It is essential to a microbolometer to have their device parameters, thermal and electrical, being extracted, in order to evaluate the processes producing the devices and to facilitate all electro-thermal SPICE model for integrated simulation. Among these parameters, the TCR and resistance can be gotten by a temperature-controlled oven. The thermal conductance and capacitance can be obtained accurately by the AC method which was published in IMTC´97. However, the absorptance of sensors still have no good and reliable method to be extracted. One of the several difficulties in measuring the absorptance is that the absorptance of V-groove type sensor is riot equivalent to the surface layer of the sensor. The reflection from the V-groove should be considered to the effective absorptance. The paper demonstrates a pure electrical without optical alignment and accurate temperature control to measure the effective absorptance fast and accurately. The fact is that the microbolometer decreases the solid thermal conductance because of microstructure, and will be dominated by radiative heat loss under the vacuum surrounding and a high sensor temperature. The measuring results of the effective absorptance are about 1.2 and consisted under the different vacuum condition, 0.1, 0.01, and 0.001 torr. The electrical method does not increase the reliability only, but also simplification of apparatus significantly
Keywords :
bolometers; microsensors; V-groove; effective absorptance measurement; electrical method; microbolometer; micromachining technology; radiative heat loss; temperature control; thermal conductance; thermal infrared sensor; Capacitance; Electric resistance; Micromachining; Microstructure; Ovens; SPICE; Temperature measurement; Temperature sensors; Thermal conductivity; Thermal sensors;
Conference_Titel :
Instrumentation and Measurement Technology Conference, 1999. IMTC/99. Proceedings of the 16th IEEE
Conference_Location :
Venice
Print_ISBN :
0-7803-5276-9
DOI :
10.1109/IMTC.1999.776792