DocumentCode :
2946526
Title :
Improvement of Switching Field in Magnetic Tunnel Junction Using Ru/Ta Capping Layer
Author :
Yen, C. ; Chen, W. ; Wang, Y. ; Yang, S. ; Shen, K. ; Kao, M. ; Tsai, M.
Author_Institution :
Ind. Technol. Res. Inst., Hsinchu
fYear :
2006
fDate :
8-12 May 2006
Firstpage :
737
Lastpage :
737
Abstract :
In this report, we will demonstrate that by simply using a bilayer capping layer of Ru/Ta instead of usually used Ta, the switching field, as well as distribution of switching fields, of magnetic tunnel junctions (MTJ) can be considerably reduced. Two samples with the same MTJ stack of Ta/PtMn/SAF-pinned/AlOx/CoFeB(2 nm) (bottom to top) but capped by different metal layers of Ta and Ru/Ta, correspondingly, were deposited on thermally oxidized Si substrates at room temperature using a UHV DC sputtering system. The R-H loops of 100 MTJs were measured at room temperature with a bias voltage of 0.1 volt for various fields. Results suggested that MTJs of high magnetoresistance (MR) ratio as well as low switching field with narrow distributions can be achieved by using CoFeB as free layer and Ru/Ta as capping layer.
Keywords :
aluminium compounds; annealing; boron alloys; cobalt alloys; iron alloys; magnetic anisotropy; magnetic switching; magnetic thin films; magnetic tunnelling; magnetoresistance; manganese alloys; platinum alloys; ruthenium; sputter etching; sputtered coatings; tantalum; AlO; CoFeB; DUV stepper; PtMn; Ru-Ta; Si; Ta; UHV DC sputtering; capping layer; film deposition; magnetic anisotropy; magnetic tunnel junction; magnetoresistance ratios; reactive ion etching; size 2 nm; switching field variations; temperature 293 K to 298 K; vacuum-annealing; voltage 0.1 V; Electronics industry; Industrial electronics; Magnetic anisotropy; Magnetic materials; Magnetic switching; Magnetic tunneling; Magnetostriction; Perpendicular magnetic anisotropy; Temperature measurement; Tunneling magnetoresistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Magnetics Conference, 2006. INTERMAG 2006. IEEE International
Conference_Location :
San Diego, CA
Print_ISBN :
1-4244-1479-2
Type :
conf
DOI :
10.1109/INTMAG.2006.376461
Filename :
4262170
Link To Document :
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