Title :
Bulk-Si with poly bump process scheme for MEMS sensors
Author :
Chun-Wen Cheng ; Kai-Chih Liang ; Chia-Hua Chu ; Te-Hao Lee ; Jiou-Kang Lee ; Chung-Hsien Lin ; Hsiao Chin Tuan ; Kalnitsky, Alex ; Weileun Fang ; Horsley, David A.
Author_Institution :
Taiwan Semicond. Manuf. Co. Ltd., Hsinchu, Taiwan
Abstract :
A MEMS process scheme designed for multi- sensors is presented. This new process scheme includes a poly bump not only provides stiction prevention and gap control function, and also electrical connection between MEMS structure and routing lines. Another advantage for this scheme is a better vacuum level because all material can be high temperature annealed before final encapsulation. This study also demonstrated some MEMS devices using this new scheme, including resonators, accelerometers and magnetometers.
Keywords :
annealing; elemental semiconductors; encapsulation; microfabrication; microsensors; sensor fusion; silicon; MEMS sensor; Si; accelerometer; electrical connection; encapsulation; gap control function; high temperature annealing; magnetometer; microfabrication; multisensor design; polybump process scheme; resonator; routing line; Accelerometers; CMOS integrated circuits; Magnetic sensors; Magnetometers; Micromechanical devices; Silicon;
Conference_Titel :
Sensors, 2012 IEEE
Conference_Location :
Taipei
Print_ISBN :
978-1-4577-1766-6
Electronic_ISBN :
1930-0395
DOI :
10.1109/ICSENS.2012.6411212
