DocumentCode :
2947505
Title :
Highly integrated ultra compact RF transceiver module for wireless data and telephone applications
Author :
Guruprasad, M. ; Chow, David
Author_Institution :
Philip Sound & Vision, Singapore
fYear :
1997
fDate :
2-4 Dec 1997
Firstpage :
238
Lastpage :
241
Abstract :
This paper describes an ultra compact DECT RF module using highly integrated concept developed by Philips. The module architecture, performance and specific advantages are presented. This state of the art module meets the most stringent requirements of DECT wireless applications
Keywords :
BiCMOS integrated circuits; MESFET integrated circuits; cordless telephone systems; data communication; modules; transceivers; BiCMOS; DECT RF module; DECT standard; MESFET IC; Philips; integrated RF transceiver module; module architecture; performance; power amplifier; telephone applications; wireless data applications; Costs; Frequency modulation; Frequency shift keying; Radio frequency; Radio transmitters; Telecommunication standards; Telephone sets; Telephony; Time division multiple access; Transceivers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Consumer Electronics, 1997. ISCE '97., Proceedings of 1997 IEEE International Symposium on
Print_ISBN :
0-7803-4371-9
Type :
conf
DOI :
10.1109/ISCE.1997.658396
Filename :
658396
Link To Document :
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