Title :
The latest advances in industrial IGBT module technology
Author :
Motto, Eric R. ; Donlon, John F.
Author_Institution :
App. Eng., Powerex Inc., Youngwood, PA, USA
Abstract :
More than ten years have elapsed since IGBT modules first emerged as the preferred power semiconductor device for a wide range of industrial applications. During this time IGBT chip and module packaging technology has evolved through multiple generations each with incremental improvements in performance and reliability. At the same time optimized processing techniques and improved yields have reduced the cost of chip manufacturing. As a result, there are often attractive opportunities to upgrade the performance of industrial power conversion equipment while simultaneously reducing cost This paper will summarize the latest advances in IGBT technology and the implications for future applications.
Keywords :
insulated gate bipolar transistors; multichip modules; optimisation; power conversion; power semiconductor devices; reliability; industrial IGBT module technology; industrial power conversion equipment; insulated gate bipolar transistors; module packaging technology; optimized processing techniques; power semiconductor device; reliability; Costs; Insulated gate bipolar transistors; MOSFET circuits; Manufacturing industries; Packaging machines; Power conversion; Power engineering and energy; Power semiconductor devices; Semiconductor device packaging; Surface structures;
Conference_Titel :
Applied Power Electronics Conference and Exposition, 2004. APEC '04. Nineteenth Annual IEEE
Print_ISBN :
0-7803-8269-2
DOI :
10.1109/APEC.2004.1295815
