• DocumentCode
    2948997
  • Title

    Area-efficient three-axis micromechanical magnetic sensor

  • Author

    Rouf, Vashwar T. ; Mo Li ; Horsley, David A.

  • Author_Institution
    Dept. of ECE, Univ. of California, Davis, Davis, CA, USA
  • fYear
    2012
  • fDate
    28-31 Oct. 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Demonstrated here is a 3-axis Lorentz force magnetic sensor based on a 0.24×0.4 mm2 MEMS resonator that is the smallest Lorentz force magnetic sensor reported to date. Using a single MEMS structure the sensor can detect magnetic field in two axes. By placing two of these sensors perpendicularly in a single die, three axis field measurement can be performed. The sensor is a MEMS resonator and sensing is performed using excitation current at the device´s in-plane and out-of-plane mechanical natural frequencies which are 40.5 kHz and 107.4 kHz respectively. Die-level vacuum packaging results in in-plane and out-of-plane mechanical quality factors of 117 and 220, respectively. With a drive power of 2 mW, the sensor´s noise is equivalent to 285 nT/√Hz for z-axis magnetic field inputs and 344 nT/√Hz for x- and y-axis fields, comparable to the performance of 3-axis Hall-effect sensors currently used in smart phones.
  • Keywords
    force sensors; magnetic sensors; microsensors; 3-axis Hall-effect sensors; 3-axis Lorentz force magnetic sensor; MEMS resonator; MEMS structure; area-efficient three-axis micromechanical magnetic sensor; die-level vacuum packaging; excitation current; frequency 107.4 kHz; frequency 40.5 kHz; in-plane mechanical natural frequency; in-plane mechanical quality factors; magnetic field detection; out-of-plane mechanical natural frequency; out-of-plane mechanical quality factors; power 2 mW; smart phones; three-axis field measurement; z-axis magnetic field inputs; Lorentz covariance; Magnetic field measurement; Magnetic fields; Micromechanical devices; Noise; Periodic structures; Sensitivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2012 IEEE
  • Conference_Location
    Taipei
  • ISSN
    1930-0395
  • Print_ISBN
    978-1-4577-1766-6
  • Electronic_ISBN
    1930-0395
  • Type

    conf

  • DOI
    10.1109/ICSENS.2012.6411324
  • Filename
    6411324