Title :
Flexible packaging for tyre integrated shear force sensor
Author :
Kulinyi, S. ; Vegvari, R. ; Pongracz, Anita ; Nagy, Akos ; Karpati, Tamas ; Adam, Maricel ; Battistig, Gabor ; Barsony, Istvany
Author_Institution :
WESZTA-T Ind. & Commercial Ltd., Budakalász, Hungary
Abstract :
Wireless Si 3D force sensor made by MEMS technology was integrated and tested on the sidewall of a tyre using flexible rubber repair patch (patent pending) in order to monitor the deformation of the rotating tyre in automotive applications. Finite element simulation was used to determine the optimal positioning of the sensor structure. Power supply and wireless communication is based on inductive coupling. Static characterization on a measurement pad and preliminary real life-testing has been carried out.
Keywords :
automobile industry; condition monitoring; deformation; elemental semiconductors; finite element analysis; force sensors; maintenance engineering; microsensors; silicon; tyres; wireless sensor networks; MEMS technology; Power supply; Si; finite element simulation; flexible packaging; flexible rubber repair patch; inductive coupling; integrated shear force sensor; measurement pad; preliminary real life-testing; tyre; wireless 3D force sensor; wireless communication; Force sensors; Piezoresistance; Roads; Sensor systems; Silicon; Tires; Wheels;
Conference_Titel :
Sensors, 2012 IEEE
Conference_Location :
Taipei
Print_ISBN :
978-1-4577-1766-6
Electronic_ISBN :
1930-0395
DOI :
10.1109/ICSENS.2012.6411326
