DocumentCode :
2949751
Title :
MEMS sensors on flexible substrates towards a smart skin
Author :
Ahmed, Mariwan ; Gonenli, I.E. ; Nadvi, G.S. ; Kilaru, R. ; Butler, Donald P. ; Celik-Butler, Zeynep
Author_Institution :
Dept. of Electr. Eng., Univ. of Texas at Arlington, Arlington, TX, USA
fYear :
2012
fDate :
28-31 Oct. 2012
Firstpage :
1
Lastpage :
4
Abstract :
This paper reviews the most recent results on the fabrication and characterization of a variety of microelectromechanical (MEMS) based sensors fabricated on flexible polymer substrates without the loss of performance, towards the development of a smart skin. These sensors include amorphous silicon based temperature sensors; nichrome based piezoresistive, absolute pressure sensors, tactile sensors and force sensors; and capacitive accelerometers. The sensors are sandwiched between a polyimide substrate and superstrate, placing them at a low stress plane, thus packaged at device-level. The flexible sensor package is grown during the device fabrication process. This allows the sensors to be integrated directly with flexible circuit boards to maintain overall flexibility. Some notable features are the incorporation of a sealed vacuum cavity for the absolute pressure sensors and the formation of a hermetically sealed cavity to contain the accelerometers in a constant atmosphere.
Keywords :
accelerometers; capacitive sensors; force sensors; intelligent sensors; microsensors; pressure sensors; skin; tactile sensors; temperature sensors; MEMS sensors; absolute pressure sensor; amorphous silicon based temperature sensor; capacitive accelerometers; flexible polymer substrate; flexible sensor package; flexible substrates; force sensors; microelectromechanical based sensor; nichrome based piezoresistive sensor; polyimide substrate; smart skin; tactile sensors; Accelerometers; Micromechanical devices; Polyimides; Sensor phenomena and characterization; Substrates; Temperature sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Sensors, 2012 IEEE
Conference_Location :
Taipei
ISSN :
1930-0395
Print_ISBN :
978-1-4577-1766-6
Electronic_ISBN :
1930-0395
Type :
conf
DOI :
10.1109/ICSENS.2012.6411363
Filename :
6411363
Link To Document :
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