Abstract :
A collection of slides from the authors conference was given. The topics included are 3D TSV technology and supply chain.
Keywords :
three-dimensional integrated circuits; 3D TSV supply chain; 3D TSV technology; through-silicon-via technology;
Conference_Titel :
Semiconductor Manufacturing (ISSM), 2010 International Symposium on
Conference_Location :
Tokyo
Print_ISBN :
978-1-4577-0392-8
