• DocumentCode
    2950517
  • Title

    Technologies and trends related to power module

  • Author

    Satoh, Kei

  • Author_Institution
    Power Device Dev. Dept, Mitsubishi Electr. Corp., Fukuoka, Japan
  • fYear
    2010
  • fDate
    18-20 Oct. 2010
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    Summary form only given. A demand to realize low carbon society becomes very strong. For CO2 reduction, energy saving and/or the new energy product used new technology such as Photovoltaic power generation technology and wind power generation technology have been introduced to the market. The power electronics is main technology for the energy-saving and will progress more in future. The power device with high power capability such as IGBT is a key component in power electronics technology and will progress more with progress of the application field. I introduce a trend of the IGBT and both wafer process technology and package technology to support high performance IGBT.
  • Keywords
    insulated gate bipolar transistors; power electronics; power markets; CO2 reduction; IGBT; energy product; low carbon society; package technology; photovoltaic power generation; power electronics; power market; power module; wafer process technology; wind power generation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing (ISSM), 2010 International Symposium on
  • Conference_Location
    Tokyo
  • ISSN
    1523-553X
  • Print_ISBN
    978-1-4577-0392-8
  • Electronic_ISBN
    1523-553X
  • Type

    conf

  • Filename
    5750186
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2950517