DocumentCode :
2950517
Title :
Technologies and trends related to power module
Author :
Satoh, Kei
Author_Institution :
Power Device Dev. Dept, Mitsubishi Electr. Corp., Fukuoka, Japan
fYear :
2010
fDate :
18-20 Oct. 2010
Firstpage :
1
Lastpage :
1
Abstract :
Summary form only given. A demand to realize low carbon society becomes very strong. For CO2 reduction, energy saving and/or the new energy product used new technology such as Photovoltaic power generation technology and wind power generation technology have been introduced to the market. The power electronics is main technology for the energy-saving and will progress more in future. The power device with high power capability such as IGBT is a key component in power electronics technology and will progress more with progress of the application field. I introduce a trend of the IGBT and both wafer process technology and package technology to support high performance IGBT.
Keywords :
insulated gate bipolar transistors; power electronics; power markets; CO2 reduction; IGBT; energy product; low carbon society; package technology; photovoltaic power generation; power electronics; power market; power module; wafer process technology; wind power generation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing (ISSM), 2010 International Symposium on
Conference_Location :
Tokyo
ISSN :
1523-553X
Print_ISBN :
978-1-4577-0392-8
Electronic_ISBN :
1523-553X
Type :
conf
Filename :
5750186
Link To Document :
بازگشت