DocumentCode :
2950533
Title :
More-than-moore reinvented
Author :
Liu, Guo-Ping
Author_Institution :
Power/MEMS Bus. Dev. Div., Taiwan Semicond. Manuf. Corp. (TSMC), Taiwan
fYear :
2010
fDate :
18-20 Oct. 2010
Firstpage :
1
Lastpage :
1
Abstract :
MtM is an old field, but it has a new life now. Green requirement, cloud computing, and natural world interfaces demand for much more sophisticated MtM solutions. This trend presents both challenges and opportunities for IDM´s, fabless companies, and foundries. To meet these new expectations for MtM, we need high tech solutions which include advanced process modules, comprehensive design kits, precise manufacturing control, and timely customization service. To compete effectively in the future MtM field, large scale manufacturing, smaller device foot print, and feature rich integration become more important. Foundries capable of delivering competitive solutions will offer a level playing field to both IDM´s and fabless companies. TSMC is committed to provide competitive MtM solutions to IDM´s and fabless companies, for diversified applications, and for the long term.
Keywords :
micromechanical devices; product customisation; MtM solutions; cloud computing; comprehensive design kits; customization service; fabless companies; feature rich integration; green requirement; natural world interfaces; precise manufacturing control; smaller device foot print;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing (ISSM), 2010 International Symposium on
Conference_Location :
Tokyo
ISSN :
1523-553X
Print_ISBN :
978-1-4577-0392-8
Electronic_ISBN :
1523-553X
Type :
conf
Filename :
5750187
Link To Document :
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