DocumentCode
2950533
Title
More-than-moore reinvented
Author
Liu, Guo-Ping
Author_Institution
Power/MEMS Bus. Dev. Div., Taiwan Semicond. Manuf. Corp. (TSMC), Taiwan
fYear
2010
fDate
18-20 Oct. 2010
Firstpage
1
Lastpage
1
Abstract
MtM is an old field, but it has a new life now. Green requirement, cloud computing, and natural world interfaces demand for much more sophisticated MtM solutions. This trend presents both challenges and opportunities for IDM´s, fabless companies, and foundries. To meet these new expectations for MtM, we need high tech solutions which include advanced process modules, comprehensive design kits, precise manufacturing control, and timely customization service. To compete effectively in the future MtM field, large scale manufacturing, smaller device foot print, and feature rich integration become more important. Foundries capable of delivering competitive solutions will offer a level playing field to both IDM´s and fabless companies. TSMC is committed to provide competitive MtM solutions to IDM´s and fabless companies, for diversified applications, and for the long term.
Keywords
micromechanical devices; product customisation; MtM solutions; cloud computing; comprehensive design kits; customization service; fabless companies; feature rich integration; green requirement; natural world interfaces; precise manufacturing control; smaller device foot print;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing (ISSM), 2010 International Symposium on
Conference_Location
Tokyo
ISSN
1523-553X
Print_ISBN
978-1-4577-0392-8
Electronic_ISBN
1523-553X
Type
conf
Filename
5750187
Link To Document