• DocumentCode
    2950533
  • Title

    More-than-moore reinvented

  • Author

    Liu, Guo-Ping

  • Author_Institution
    Power/MEMS Bus. Dev. Div., Taiwan Semicond. Manuf. Corp. (TSMC), Taiwan
  • fYear
    2010
  • fDate
    18-20 Oct. 2010
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    MtM is an old field, but it has a new life now. Green requirement, cloud computing, and natural world interfaces demand for much more sophisticated MtM solutions. This trend presents both challenges and opportunities for IDM´s, fabless companies, and foundries. To meet these new expectations for MtM, we need high tech solutions which include advanced process modules, comprehensive design kits, precise manufacturing control, and timely customization service. To compete effectively in the future MtM field, large scale manufacturing, smaller device foot print, and feature rich integration become more important. Foundries capable of delivering competitive solutions will offer a level playing field to both IDM´s and fabless companies. TSMC is committed to provide competitive MtM solutions to IDM´s and fabless companies, for diversified applications, and for the long term.
  • Keywords
    micromechanical devices; product customisation; MtM solutions; cloud computing; comprehensive design kits; customization service; fabless companies; feature rich integration; green requirement; natural world interfaces; precise manufacturing control; smaller device foot print;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing (ISSM), 2010 International Symposium on
  • Conference_Location
    Tokyo
  • ISSN
    1523-553X
  • Print_ISBN
    978-1-4577-0392-8
  • Electronic_ISBN
    1523-553X
  • Type

    conf

  • Filename
    5750187