Numerical investigation of radiated emissions mechanisms in single-chip packages

Author

Aguirre, Gerardo ; Cangellaris, Andreas C. ; Pasik, Michael F.

Author_Institution

Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA

fYear

1996

fDate

28-31 May 1996

Firstpage

996

Lastpage

1001

Abstract

Presents preliminary results for a new way of addressing radiated emissions from packaged electronic systems. We have validated the FDTD methodology for determining the peak radiation frequencies for a simple microstrip transmission line structure. Also, we have demonstrated the impact of placing ground pins between the signal and absolute ground planes on the radiation characteristics of a microstrip line capacitively coupled to an absolute ground. The placement and location of grounding pins is critical to the reduction of EMI

Keywords

electromagnetic interference; finite difference time-domain analysis; integrated circuit packaging; microstrip lines; EMI; FDTD methodology; ground pins; ground planes; microstrip transmission line structure; packaged electronic systems; peak radiation frequencies; radiated emissions mechanisms; radiation characteristics; single-chip packages; Couplings; Electromagnetic interference; Electronics packaging; Finite difference methods; Frequency; Grounding; Microstrip; Pins; Time domain analysis; Transmission lines;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1996. Proceedings., 46th

Conference_Location

Orlando, FL

ISSN

0569-5503

Print_ISBN

0-7803-3286-5

Type

conf

DOI

10.1109/ECTC.1996.550515

Filename

550515