Author :
Chen, C.K. ; Yost, D.R.W. ; Aull, Brian F. ; Chen, C.L. ; Gouker, P.M. ; Knecht, J.M. ; Tyrrell, B.M. ; Warner, Keith ; Wheeler, B. ; Wyatt, P.W. ; Keast, C.L. ; Suntharalingam, V.
Keywords :
CMOS integrated circuits; focal planes; infrared detectors; integrated circuit bonding; lithography; optical radar; three-dimensional integrated circuits; 3-tier single-photon laser-radar focal plane; 3D integrated circuit process flow; 3D-enabled heterogeneous integrated circuit; CMOS technology; Nyquist-limited IR focal plane; SWIR detector; bonding; lithographic requirement; pad-level 3D integration; Conferences; Contracts; Government; Integrated circuit interconnections; Silicon; Three-dimensional displays;
