Title :
Flip-chip assembly for senior designs in the 21st century
Author :
Lee, Y.C. ; Qing Tan
Author_Institution :
Dept. of Mech. Eng., Colorado Univ., Boulder, CO, USA
Abstract :
A new thermosonic flip-chip bonding technology has been developed. It is compatible with wire bonding and eliminates the need of solder bumping on wafers. As a result, this technology could be applied to enhance Senior Design type of courses using flip-chip assembly to design, assemble and test innovative systems. The technology will be described with a list of different modules prototyped for microelectronics, optoelectronics, microwave/millimeter-wave, and microelectromechanical systems. We are looking for collaborators to investigate different possible curricular enhancements using this new technology
Keywords :
educational courses; electronic engineering education; flip-chip devices; technological forecasting; 21st century; Senior Design course; assembly; educational curriculum; microelectromechanical system; microelectronics; microwave system; millimeter-wave system; optoelectronics; thermosonic flip-chip bonding technology; Assembly systems; Collaboration; Microelectromechanical systems; Microelectronics; Microwave technology; Millimeter wave technology; Prototypes; System testing; Wafer bonding; Wire;
Conference_Titel :
Microelectronic Systems Education, 1997. MSE '97. Proceedings., 1997 IEEE International Conference on
Conference_Location :
Arlington, VA
Print_ISBN :
0-8186-7996-4
DOI :
10.1109/MSE.1997.612583
