• DocumentCode
    2951710
  • Title

    Flip-chip assembly for senior designs in the 21st century

  • Author

    Lee, Y.C. ; Qing Tan

  • Author_Institution
    Dept. of Mech. Eng., Colorado Univ., Boulder, CO, USA
  • fYear
    1997
  • fDate
    21-23 Jul 1997
  • Firstpage
    137
  • Lastpage
    138
  • Abstract
    A new thermosonic flip-chip bonding technology has been developed. It is compatible with wire bonding and eliminates the need of solder bumping on wafers. As a result, this technology could be applied to enhance Senior Design type of courses using flip-chip assembly to design, assemble and test innovative systems. The technology will be described with a list of different modules prototyped for microelectronics, optoelectronics, microwave/millimeter-wave, and microelectromechanical systems. We are looking for collaborators to investigate different possible curricular enhancements using this new technology
  • Keywords
    educational courses; electronic engineering education; flip-chip devices; technological forecasting; 21st century; Senior Design course; assembly; educational curriculum; microelectromechanical system; microelectronics; microwave system; millimeter-wave system; optoelectronics; thermosonic flip-chip bonding technology; Assembly systems; Collaboration; Microelectromechanical systems; Microelectronics; Microwave technology; Millimeter wave technology; Prototypes; System testing; Wafer bonding; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronic Systems Education, 1997. MSE '97. Proceedings., 1997 IEEE International Conference on
  • Conference_Location
    Arlington, VA
  • Print_ISBN
    0-8186-7996-4
  • Type

    conf

  • DOI
    10.1109/MSE.1997.612583
  • Filename
    612583
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2951710