DocumentCode :
2951748
Title :
Radiation effects in advanced SOI devices: New insights into Total Ionizing Dose and Single-Event Effects
Author :
Gaillardin, M. ; Raine, M. ; Paillet, P. ; Martinez, Manuel ; Marcandella, C. ; Girard, S. ; Duhamel, O. ; Richard, N. ; Andrieu, F. ; Barraud, S. ; Faynot, O.
Author_Institution :
DAM, CEA, Arpajon, France
fYear :
2013
fDate :
7-10 Oct. 2013
Firstpage :
1
Lastpage :
2
Abstract :
The SOI technology has already demonstrated intrinsic resistance to transient radiation effects due to the dielectric isolation provided by the buried oxide. But this special feature raises questions about their Total Ionizing Dose (TID) sensitivity, particularly in Fully Depleted (FD) SOI and multiple-gate devices. This paper thus gives an overview of recent advances in radiation effects on innovative SOI devices. Both TID and Single-Event Effects (SEE) in Extra Thin SOI (ETSOI) and FinFET devices are reviewed as well as upcoming challenges to mitigate radiation effects in nanometer scale SOI technologies.
Keywords :
MOSFET; nanoelectronics; radiation hardening (electronics); silicon-on-insulator; ETSOI; FD SOI; FinFET devices; SEE; TID sensitivity; advanced SOI devices; buried oxide; dielectric isolation; extra thin SOI; fully depleted SOI; intrinsic resistance; multiple-gate devices; nanometer scale SOI technology; single-event effects; total ionizing dose effect; transient radiation effect mitigation; FinFETs; Geometry; Logic gates; Radiation effects; Silicon; Threshold voltage; Transient analysis; Extra-Thin SOI (ETSOI); FinFET; Fully Depleted (FD); Silicon-On-Insulator (SOI); Single-Event Effects (SEE); Single-Event Transient (SET); Total Ionizing Dose (TID); Ultra-Thin BOX and Body (UTBB); multiple-gate FET;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2013 IEEE
Conference_Location :
Monterey, CA
Type :
conf
DOI :
10.1109/S3S.2013.6716530
Filename :
6716530
Link To Document :
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