• DocumentCode
    2952172
  • Title

    Electrical and mechanical properties of a metal-filled polymer composite for interconnection and testing applications

  • Author

    Fulton, J.A. ; Horton, D.R. ; Moore, R.C. ; Lambert, W.R. ; Jin, S. ; Opila, R.L. ; Sherwood, R.C. ; Tiefel, T.H. ; Mottine, J.J.

  • Author_Institution
    AT&T Bell Labs., Princeton, NJ, USA
  • fYear
    1989
  • fDate
    22-24 May 1989
  • Firstpage
    71
  • Lastpage
    77
  • Abstract
    A group of metal-filled polymer composites developed as compliant interconnection materials for connector and testing applications is discussed. This material group is referred to as elastomeric conductive polymer interconnection (ECPI) materials. ECPIs make electrical connection between opposing contact areas using conductive columns that are uniformly distributed within a sheet of silicone rubber and are separated by a spacing of 7 mil or less. The materials are suitable for interconnecting high-density, fine-pitch, pad-grid arrays and are capable of accommodating tolerance variations arising from plating thickness, substrate warp, and nonplanarities between opposing contact areas. ECPIs can be deformed by up to 40% of their uncompressed thickness without compromising their electrical properties. For the high-performance interconnections the material should be less than 20 mil, which would provide a maximum compliance of 8 mil
  • Keywords
    electric connectors; filled polymers; packaging; printed circuit accessories; 7 to 20 mil; compliant interconnection materials; conductive columns; elastomeric conductive polymer interconnection materials; electrical properties; fine pitch arrays; high density arrays; high-performance interconnections; maximum compliance; mechanical properties; metal-filled polymer composite; opposing contact area nonplanarities; opposing contact areas; pad-grid arrays; plating thickness; silicone rubber sheet; substrate warp; testing applications; tolerance variations; uncompressed thickness; Composite materials; Conducting materials; Connectors; Contacts; Inorganic materials; Materials testing; Mechanical factors; Polymers; Rubber; Sheet materials;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components Conference, 1989. Proceedings., 39th
  • Conference_Location
    Houston, TX
  • Type

    conf

  • DOI
    10.1109/ECC.1989.77729
  • Filename
    77729