DocumentCode
2952812
Title
A review of substrate coupling issues and modeling strategies
Author
Singh, Raminderpal
Author_Institution
Cadence Design Syst. Inc., San Jose, CA, USA
fYear
1999
fDate
1999
Firstpage
491
Lastpage
499
Abstract
This tutorial paper reviews the technologies behind substrate coupling and modeling. The key focuses throughout are the importance of suitable substrate models and a sufficient understanding of the substrate coupling in the circuit being designed. Discussions include Radio Frequency (RF) and Mixed-Signal (MS) designs, but also touch upon System-on-Chip (SoC). An example RF circuit is simulated with a substrate model and the effect of substrate process variations on the circuit´s performance is discussed
Keywords
UHF integrated circuits; integrated circuit layout; integrated circuit modelling; mixed analogue-digital integrated circuits; reviews; substrates; RF designs; floorplanning; mixed-signal designs; modeling strategies; review; substrate coupling issues; substrate models; system-on-chip; Application specific integrated circuits; Conductivity; Coupling circuits; Digital signal processing; Doping profiles; Paper technology; Radio frequency; Sensor systems; Substrates; System-on-a-chip;
fLanguage
English
Publisher
ieee
Conference_Titel
Custom Integrated Circuits, 1999. Proceedings of the IEEE 1999
Conference_Location
San Diego, CA
Print_ISBN
0-7803-5443-5
Type
conf
DOI
10.1109/CICC.1999.777329
Filename
777329
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