• DocumentCode
    2952812
  • Title

    A review of substrate coupling issues and modeling strategies

  • Author

    Singh, Raminderpal

  • Author_Institution
    Cadence Design Syst. Inc., San Jose, CA, USA
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    491
  • Lastpage
    499
  • Abstract
    This tutorial paper reviews the technologies behind substrate coupling and modeling. The key focuses throughout are the importance of suitable substrate models and a sufficient understanding of the substrate coupling in the circuit being designed. Discussions include Radio Frequency (RF) and Mixed-Signal (MS) designs, but also touch upon System-on-Chip (SoC). An example RF circuit is simulated with a substrate model and the effect of substrate process variations on the circuit´s performance is discussed
  • Keywords
    UHF integrated circuits; integrated circuit layout; integrated circuit modelling; mixed analogue-digital integrated circuits; reviews; substrates; RF designs; floorplanning; mixed-signal designs; modeling strategies; review; substrate coupling issues; substrate models; system-on-chip; Application specific integrated circuits; Conductivity; Coupling circuits; Digital signal processing; Doping profiles; Paper technology; Radio frequency; Sensor systems; Substrates; System-on-a-chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits, 1999. Proceedings of the IEEE 1999
  • Conference_Location
    San Diego, CA
  • Print_ISBN
    0-7803-5443-5
  • Type

    conf

  • DOI
    10.1109/CICC.1999.777329
  • Filename
    777329