Title :
A high-density multipin connector with newly developed miniature compliant press-in pin connection
Author :
Yasuda, Kei-ichi ; Inagaki, Shuichiro ; Nakano, Kenichi
Author_Institution :
NTT, Tokyo, Japan
Abstract :
A high-density multipin connector that utilizes a miniature compliant press-in pin connection applied to the smaller plated-through hole to connect the pin and the backpanel is discussed. The procedure for designing the connection is described. Numerical elastic-plastic deformation analysis is used. A miniature press-in pin has been fabricated using the results of the analysis, and its mechanical performance is examined. Reliability tests confirmed that the contact resistance characteristics are sufficiently stable. The connector is applicable to equipment used in electrical communication systems
Keywords :
CAD; design engineering; electric connectors; environmental testing; reliability; contact resistance characteristics; design procedure; electrical communication systems; high-density multipin connector; mechanical performance; miniature compliant press-in pin connection; numerical elastic-plastic deformation analysis; reliability tests; smaller plated-through hole; Assembly; Circuit noise; Connectors; Contacts; Crosstalk; Finite element methods; Impedance; Lead; Performance analysis; Pins;
Conference_Titel :
Electronic Components Conference, 1989. Proceedings., 39th
Conference_Location :
Houston, TX
DOI :
10.1109/ECC.1989.77737