A high-density multipin connector with newly developed miniature compliant press-in pin connection

Author

Yasuda, Kei-ichi ; Inagaki, Shuichiro ; Nakano, Kenichi

Author_Institution

NTT, Tokyo, Japan

fYear

1989

fDate

22-24 May 1989

Firstpage

121

Lastpage

126

Abstract

A high-density multipin connector that utilizes a miniature compliant press-in pin connection applied to the smaller plated-through hole to connect the pin and the backpanel is discussed. The procedure for designing the connection is described. Numerical elastic-plastic deformation analysis is used. A miniature press-in pin has been fabricated using the results of the analysis, and its mechanical performance is examined. Reliability tests confirmed that the contact resistance characteristics are sufficiently stable. The connector is applicable to equipment used in electrical communication systems

Keywords

CAD; design engineering; electric connectors; environmental testing; reliability; contact resistance characteristics; design procedure; electrical communication systems; high-density multipin connector; mechanical performance; miniature compliant press-in pin connection; numerical elastic-plastic deformation analysis; reliability tests; smaller plated-through hole; Assembly; Circuit noise; Connectors; Contacts; Crosstalk; Finite element methods; Impedance; Lead; Performance analysis; Pins;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components Conference, 1989. Proceedings., 39th

Conference_Location

Houston, TX

Type

conf

DOI

10.1109/ECC.1989.77737

Filename

77737