• DocumentCode
    2953471
  • Title

    Sub-fF trimmable readout circuit for tri-axes capacitive microaccelerometers

  • Author

    Hyun Kyu Ouh ; Jungryoul Choi ; Jungwoo Lee ; Sangyun Han ; Sungwook Kim ; Jindeok Seo ; Kyomook Lim ; Hyoungho Ko

  • Author_Institution
    Leading Div., TLi Inc., Seongnam, South Korea
  • fYear
    2012
  • fDate
    28-31 Oct. 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    As the sensing capacitances of the recent microaccelerometers become smaller, a precise calibration method is highly required to compensate for the input parasitic capacitance mismatch. This paper presents a sub-fF trimmable readout circuit for capacitive tri-axes microaccelerometer. A charge sensitive amplifier (CSA) with correlated double sampling (CDS) and digital to-equivalent capacitance converter (DECC) is proposed. The DECC is implemented using 10-bit DAC, charge transfer switches, and a charge-storing capacitor. The DECC circuit can realize the equivalent capacitance of sub-fF range with a smaller area and higher accuracy than previous methods using series-connected capacitors. The readout circuit is implemented in a 0.18 μm 1P4M CMOS process. The readout circuit and MEMS sensing element are integrated in a single package. The supply voltage and the current consumption of analog blocks are 3.3 V and 230 μA, respectively. The sensitivities of tri-axes are measured to be 3.87 mg/LSB, 3.87 mg/LSB and 3.90 mg/LSB, respectively. The offset calibration which is controlled by 10-bit DECC has a resolution of 12.4 LSB per step with high linearity. The noise levels of tri-axes are 349 μg/√Hz, 341 μg/√Hz and 411 μg/√Hz at 2 kHz bandwidth.
  • Keywords
    CMOS integrated circuits; accelerometers; microsensors; readout electronics; CMOS process; charge sensitive amplifier; correlated double sampling; digital to-equivalent capacitance converter; parasitic capacitance mismatch; sensing capacitances; sub-fF trimmable readout circuit; tri-axes capacitive microaccelerometers; Calibration; Capacitance; Capacitors; Electronics packaging; Micromechanical devices; Noise; Sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2012 IEEE
  • Conference_Location
    Taipei
  • ISSN
    1930-0395
  • Print_ISBN
    978-1-4577-1766-6
  • Electronic_ISBN
    1930-0395
  • Type

    conf

  • DOI
    10.1109/ICSENS.2012.6411568
  • Filename
    6411568