• DocumentCode
    2954191
  • Title

    Interfacial interactions affecting polyimide reliability

  • Author

    Nagarkar, P.V. ; Searson, P.C. ; Belluci, F. ; Allen, M.G. ; Latanision, R.M.

  • Author_Institution
    MIT, Cambridge, MA, USA
  • fYear
    1989
  • fDate
    22-24 May 1989
  • Firstpage
    160
  • Lastpage
    166
  • Abstract
    An X-ray photoelectron spectroscopy (XPS) study of the interfacial chemistry of the polyimide PMDA-ODA on exposure to air, water, and NaCl solution for extended periods of time is discussed. A spin-coated polyimide layer is oxygen deficient and possibly contains peaks due to the solvent. In the present work one carbonyl moiety per repeat unit was found to be deficient and could not be regenerated by water immersion. On immersing spin-coated PMDS-ODA in water, the solvent peaks were eliminated. For PMDA-ODA in NaCl, although no ions were detected on the backside of the polyimide, substantial reaction of the polyimide was observed that was different from the interaction of polyimide with water, in spite of the near neutrality in pH of both aqueous solutions, indicating the influence of ions on the reaction
  • Keywords
    corrosion protective coatings; environmental testing; materials testing; packaging; polymer films; reliability; NaCl-H2O; X-ray photoelectron spectroscopy; XPS; air exposure; aqueous solutions; carbonyl moiety; interfacial chemistry; interfacial reactions; ions; neutrality; pH; polyimide PMDA-ODA; reliability; solvent peaks; spin-coated polyimide layer; water exposure; water immersion; Aluminum; Chemicals; Circuits; Corrosion; Electronics packaging; Microelectronics; Moisture; Polyimides; Silicon; Spectroscopy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components Conference, 1989. Proceedings., 39th
  • Conference_Location
    Houston, TX
  • Type

    conf

  • DOI
    10.1109/ECC.1989.77743
  • Filename
    77743