DocumentCode :
2954191
Title :
Interfacial interactions affecting polyimide reliability
Author :
Nagarkar, P.V. ; Searson, P.C. ; Belluci, F. ; Allen, M.G. ; Latanision, R.M.
Author_Institution :
MIT, Cambridge, MA, USA
fYear :
1989
fDate :
22-24 May 1989
Firstpage :
160
Lastpage :
166
Abstract :
An X-ray photoelectron spectroscopy (XPS) study of the interfacial chemistry of the polyimide PMDA-ODA on exposure to air, water, and NaCl solution for extended periods of time is discussed. A spin-coated polyimide layer is oxygen deficient and possibly contains peaks due to the solvent. In the present work one carbonyl moiety per repeat unit was found to be deficient and could not be regenerated by water immersion. On immersing spin-coated PMDS-ODA in water, the solvent peaks were eliminated. For PMDA-ODA in NaCl, although no ions were detected on the backside of the polyimide, substantial reaction of the polyimide was observed that was different from the interaction of polyimide with water, in spite of the near neutrality in pH of both aqueous solutions, indicating the influence of ions on the reaction
Keywords :
corrosion protective coatings; environmental testing; materials testing; packaging; polymer films; reliability; NaCl-H2O; X-ray photoelectron spectroscopy; XPS; air exposure; aqueous solutions; carbonyl moiety; interfacial chemistry; interfacial reactions; ions; neutrality; pH; polyimide PMDA-ODA; reliability; solvent peaks; spin-coated polyimide layer; water exposure; water immersion; Aluminum; Chemicals; Circuits; Corrosion; Electronics packaging; Microelectronics; Moisture; Polyimides; Silicon; Spectroscopy;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components Conference, 1989. Proceedings., 39th
Conference_Location :
Houston, TX
Type :
conf
DOI :
10.1109/ECC.1989.77743
Filename :
77743
Link To Document :
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