DocumentCode
2954324
Title
The thermal effect on conduction of dielectric liquid with bound water
Author
Ohta, Koji ; Iwasawa, Tomohide ; Itahashi, Satoru ; Hayashi, Yoshinori ; Mitsui, Hideo ; Sone, Mototaka
Author_Institution
Musashi Inst. of Technol., Tokyo, Japan
Volume
2
fYear
1997
fDate
19-22, Oct 1997
Firstpage
684
Abstract
Thermal dependence of Dielectric property and conductivity of dielectric liquid dissolving bound water were measured and the effect of hydrogen bonded molecular orientation structure on conduction mechanism was discussed. In the free volume, water binding with dielectric does not change its orientation structure so that dielectric constant (∈s) increase. Bound water were suggested disperse homogeneously in the liquid macroscopically. And It was appeared that the more polarized liquid water dissolve in, the more effective bound water and temperature increase conductivity
Keywords
dielectric liquids; electrical conductivity; hydrogen bonds; molecular orientation; permittivity; water; bound water; conduction; dielectric constant; dielectric liquid; hydrogen bonding; molecular orientation structure; thermal effect; Bonding; Conductivity measurement; Dielectric constant; Dielectric liquids; Dielectric measurements; Hydrogen; Mechanical factors; Optical polarization; Thermal conductivity; Water;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena, 1997. IEEE 1997 Annual Report., Conference on
Conference_Location
Minneapolis, MN
Print_ISBN
0-7803-3851-0
Type
conf
DOI
10.1109/CEIDP.1997.641167
Filename
641167
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