Photosensitive polyimides with excellent adhesive property for integrated circuit devices

Two photosensitive polyimides having ionic connection of photoreactive groups to the backbone, of interest for application to passivation and protective layers are discussed. The synthesis and chemistry of the materials, their adhesive, mechanical, electrical, and optical properties, and typical pattern-generation processes are discussed. One polyimide was found to have poor adhesion to substrate materials such as silicon, aluminium, Si₃N₄ and molding compounds. The other had excellent adhesion to them even after exposure to high temperature and high humidity, as well as high photospeed and good film properties, making them a reliable material for use in integrated circuit devices