Title :
Inner lead bonding techniques for 500 lead dies having a 90 μm lead pitch
Author :
Atsumi, Koichiro ; Kashima, Noriyasu ; Maehara, Yoichiro ; Mitsuhashi, Tatsuro ; Komatsu, Tetsuro ; Ochiai, Nobuo
Author_Institution :
Toshiba Corp., Yokohamashi, Japan
Abstract :
A study of tape automated bonding (TAB) undertaken in order to investigate the application of 500-lead bonding in mass production is discussed. The Toshiba TT1-700, the automatic inner lead bonder used, has a maximum applied pressure of 30 kgf, an alignment accuracy of 10 μm, and an index time of 3.9 s, including a 1-s bonding time. The machine´s alignment and bonding accuracy, the determination of acceptable bonding conditions, the effects of tool planarity an parallelism on bond strength and bump deformation, and the effects of bonding conditions on the rate of bond strength degradation during continuous bonding, using 12.7-mm2 and 504-lead test dies with a lead pitch of 90 μm, are discussed. Employment of the TTI-700 resulted in highly accurate inner lead bonding for finely pitched leads with high lead counts
Keywords :
integrated circuit manufacture; lead bonding; 1 s; 10 micron; 3.9 s; 30 kgf/m2; 90 micron; TAB); Toshiba TT1-700; alignment accuracy; applied pressure; bond strength; bond strength degradation rate; bonding conditions; bonding time; bump deformation; continuous bonding; finely pitched leads; index time; inner lead bonding; lead counts; lead dies; lead pitch; mass production; microassembly; tape automated bonding; tool parallelism; tool planarity; Assembly; Bonding; Copper; Degradation; Dies; Liquid crystal displays; Manufacturing; Mass production; Polyimides; Testing;
Conference_Titel :
Electronic Components Conference, 1989. Proceedings., 39th
Conference_Location :
Houston, TX
DOI :
10.1109/ECC.1989.77745
