• DocumentCode
    2954498
  • Title

    Wafer-scale integration of analog neural networks

  • Author

    Schemmel, Johannes ; Fieres, Johannes ; Meier, Karlheinz

  • Author_Institution
    Kirchhoff Inst. for Phys., Univ. of Heidelberg, Heidelberg
  • fYear
    2008
  • fDate
    1-8 June 2008
  • Firstpage
    431
  • Lastpage
    438
  • Abstract
    This paper introduces a novel design of an artificial neural network tailored for wafer-scale integration. The presented VLSI implementation includes continuous-time analog neurons with up to 16 k inputs. A novel interconnection and routing scheme allows the mapping of a multitude of network models derived from biology on the VLSI neural network while maintaining a high resource usage. A single 20 cm wafer contains about 60 million synapses. The implemented neurons are highly accelerated compared to biological real time. The power consumption of the dense interconnection network providing the necessary communication bandwidth is a critical aspect of the system integration. A novel asynchronous low-voltage signaling scheme is presented that makes the wafer-scale approach feasible by limiting the total power consumption while simultaneously providing a flexible, programmable network topology.
  • Keywords
    analogue integrated circuits; integrated circuit interconnections; network routing; neural chips; wafer-scale integration; VLSI implementation; artificial neural network; asynchronous low-voltage signaling scheme; continuous-time analog neural networks; interconnection network; interconnection-routing scheme; power consumption; programmable network topology; wafer-scale integration; Artificial neural networks; Biological system modeling; Computational biology; Energy consumption; Neural networks; Neurons; Routing; Semiconductor device modeling; Very large scale integration; Wafer scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Neural Networks, 2008. IJCNN 2008. (IEEE World Congress on Computational Intelligence). IEEE International Joint Conference on
  • Conference_Location
    Hong Kong
  • ISSN
    1098-7576
  • Print_ISBN
    978-1-4244-1820-6
  • Electronic_ISBN
    1098-7576
  • Type

    conf

  • DOI
    10.1109/IJCNN.2008.4633828
  • Filename
    4633828