DocumentCode
2955107
Title
Structure noise reduction and deconvolution of ultrasonic data using wavelet decomposition (ultrasonic flaw detection)
Author
Aussel, J.-D. ; Monchalin, J.P.
Author_Institution
Nat. Res. Council Canada, Boucherville, Que., Canada
fYear
1989
fDate
3-6 Oct 1989
Firstpage
1139
Abstract
The split-spectrum processing (SSP) technique is known to improve flaw detection in materials in which the coarse microstructure produces broadband noise of large amplitude, which masks useful signals. It is shown that the spectral decomposition used in the SSP is equivalent to the time-frequency Gabor decomposition. A generalized SSP based on a wavelet decomposition, in which the received signal is decomposed over a basis of elementary wavelets translated in frequency and dilated in time, and followed as in the conventional SSP by an optimization algorithm is introduced. The flexibility in the choice of the wavelet basis allows implementation of efficient signal decomposition. Three wavelet bases are presented: Gaussian-shaped wavelets, binary wavelets, and autoregressive wavelets. Applications of the SSP with wavelet decomposition to noise reduction and deconvolution are illustrated with experimental and simulated data
Keywords
acoustic signal processing; crystal microstructure; flaw detection; ultrasonic materials testing; C; Gaussian-shaped wavelets; austenitic steel plate; autoregressive wavelets; binary wavelets; broadband noise; coarse microstructure; deconvolution; flaw detection; frequency translation; graphite-epoxy plate; optimization algorithm; simulated data; spectral decomposition; split-spectrum processing technique; structure noise reduction; time dilation; time-frequency Gabor decomposition; ultrasonic data; wavelet decomposition; Bandwidth; Composite materials; Deconvolution; Filters; Gaussian processes; Microstructure; Noise reduction; Signal processing; Signal to noise ratio; Time frequency analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 1989. Proceedings., IEEE 1989
Conference_Location
Montreal, Que.
Type
conf
DOI
10.1109/ULTSYM.1989.67167
Filename
67167
Link To Document