• DocumentCode
    2955107
  • Title

    Structure noise reduction and deconvolution of ultrasonic data using wavelet decomposition (ultrasonic flaw detection)

  • Author

    Aussel, J.-D. ; Monchalin, J.P.

  • Author_Institution
    Nat. Res. Council Canada, Boucherville, Que., Canada
  • fYear
    1989
  • fDate
    3-6 Oct 1989
  • Firstpage
    1139
  • Abstract
    The split-spectrum processing (SSP) technique is known to improve flaw detection in materials in which the coarse microstructure produces broadband noise of large amplitude, which masks useful signals. It is shown that the spectral decomposition used in the SSP is equivalent to the time-frequency Gabor decomposition. A generalized SSP based on a wavelet decomposition, in which the received signal is decomposed over a basis of elementary wavelets translated in frequency and dilated in time, and followed as in the conventional SSP by an optimization algorithm is introduced. The flexibility in the choice of the wavelet basis allows implementation of efficient signal decomposition. Three wavelet bases are presented: Gaussian-shaped wavelets, binary wavelets, and autoregressive wavelets. Applications of the SSP with wavelet decomposition to noise reduction and deconvolution are illustrated with experimental and simulated data
  • Keywords
    acoustic signal processing; crystal microstructure; flaw detection; ultrasonic materials testing; C; Gaussian-shaped wavelets; austenitic steel plate; autoregressive wavelets; binary wavelets; broadband noise; coarse microstructure; deconvolution; flaw detection; frequency translation; graphite-epoxy plate; optimization algorithm; simulated data; spectral decomposition; split-spectrum processing technique; structure noise reduction; time dilation; time-frequency Gabor decomposition; ultrasonic data; wavelet decomposition; Bandwidth; Composite materials; Deconvolution; Filters; Gaussian processes; Microstructure; Noise reduction; Signal processing; Signal to noise ratio; Time frequency analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 1989. Proceedings., IEEE 1989
  • Conference_Location
    Montreal, Que.
  • Type

    conf

  • DOI
    10.1109/ULTSYM.1989.67167
  • Filename
    67167