DocumentCode
2955425
Title
Facet preparation of SOI waveguides by etching and cleaving compared to dicing and polishing
Author
Schnarrenberger, Martin ; Zimmermann, Lars ; Mitze, Torsten ; Bruns, Jiirgen ; Petermann, Klaus
Author_Institution
Technische Univ. Berlin, Germany
fYear
2004
fDate
29 Sept.-1 Oct. 2004
Firstpage
72
Lastpage
74
Abstract
We compared two different techniques of facet preparation of silicon-on-insulator (SOI) waveguides: The conventional by dicing and polishing and our proposed by dry etching the facets and cleaving along anisotropically etched cleaving grooves.
Keywords
etching; materials preparation; optical fabrication; optical waveguides; polishing; silicon-on-insulator; SOI waveguides; Si; anisotropically etched grooves; cleaving; cleaving grooves; dicing; dry etching; facet preparation; polishing; Dry etching; Geometrical optics; Integrated optics; Optical device fabrication; Optical devices; Optical fiber networks; Optical filters; Optical materials; Optical waveguides; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Group IV Photonics, 2004. First IEEE International Conference on
Print_ISBN
0-7803-8474-1
Type
conf
DOI
10.1109/GROUP4.2004.1416657
Filename
1416657
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