Tapered active layer laser device performance and its impact on low cost optoelectronics

Author

Lealman, I.F. ; MacDonald, B.M. ; Collins, J.V. ; Fiddyment, P.J. ; Jones, C.A. ; Waller, R.G. ; Robertson, M.J. ; Rivers, L.J. ; Peed, C.M. ; Cooper, K. ; Perrin, S.D. ; Nield, M.W. ; Harlow, M.J.

Author_Institution

British Telecom Res. Labs., Ipswich, UK

Volume

1

fYear

1995

fDate

30-31 Oct 1995

Firstpage

11

Abstract

75% coupling to cleaved single mode fibre has been obtained for a 1.55 μm tapered active strained MQW layer device. A fully packaged component using precision laser die cleaving and a silicon micro machined substrate has produced a record 55% passive coupling

Keywords

integrated optoelectronics; optical communication equipment; optical fibre couplers; packaging; quantum well lasers; substrates; 1.55 mum; cleaved single mode fibre coupling; fully packaged component; low cost optoelectronics; passive coupling; precision laser die cleaving; silicon micro machined substrate; tapered active layer laser device performance; tapered active strained MQW layer device; Costs; Fiber lasers; Laser modes; Optical design; Optical device fabrication; Optical fiber devices; Packaging machines; Pump lasers; Semiconductor device packaging; Semiconductor lasers;

fLanguage

English

Publisher

ieee

Conference_Titel

Lasers and Electro-Optics Society Annual Meeting, 1995. 8th Annual Meeting Conference Proceedings, Volume 1., IEEE

Conference_Location

San Francisco, CA

Print_ISBN

0-7803-2450-1

Type

conf

DOI

10.1109/LEOS.1995.484483

Filename

484483