Developments in multi-channel optical interconnects under ESPRIT III SPIBOC

Future systems, such as ATM switches and massively parallel data base servers, will require high capacity rack-to-rack and board-to-board interconnections. Optical interconnects, because of their extremely high bandwidth and EMC immunity, are extremely attractive for these applications. However, in order to compete with conventional solutions, the cost of modules and the availability of suitable interconnect media (such as blind mating back plane connectors) need to be seriously addressed. The ESPRIT-III-SPIBOC project is doing so through the development of specifications, taken from the requirements of a large number of computer, telecomms and other users (both internal and external to the project), and the subsequent fabrication of modules and interconnects to meet these needs. By specifying components suitable for a large number of applications, and addressing gaps in the component sets currently available, the potential market volumes are increased, enabling lower cost and earlier introduction of these solutions