DocumentCode
295686
Title
Self-aligned assembly technology for laser diode modules using stripe-type AuSn solder bump flip-chip bonding
Author
Sasaki, Junichi ; Honmou, Hiroshi ; Itoh, Masataka ; Uda, Akihiro ; Torikai, Toshitaka
Author_Institution
Functional Devices Res. Labs., NEC Corp., Kawasaki, Japan
Volume
1
fYear
1995
fDate
30-31 Oct 1995
Firstpage
234
Abstract
Alignment-free laser diode module assembly technology has been developed. The laser diode is self-aligned to a single-mode optical fiber (SMF) by using stripe-type AuSn solder bumps. Alignment error of ±1 μm has been achieved
Keywords
flip-chip devices; modules; optical fibre couplers; reflow soldering; semiconductor lasers; AuSn; alignment-free module assembly; flip-chip bonding; laser diode modules; punching method; reflow soldered; self-aligned assembly technology; single-mode optical fiber; stripe-type AuSn solder bump; Assembly; Bonding; Costs; Diode lasers; Laboratories; Optical devices; Optical films; Optical receivers; Optical transmitters; Punching;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics Society Annual Meeting, 1995. 8th Annual Meeting Conference Proceedings, Volume 1., IEEE
Conference_Location
San Francisco, CA
Print_ISBN
0-7803-2450-1
Type
conf
DOI
10.1109/LEOS.1995.484848
Filename
484848
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