Title :
300 mm evaluation activities in Selete
Author_Institution :
Semicond. Leading Edge Technol., Yokohama, Japan
Abstract :
300 mm equipment and materials are being developed in order to start IC mass production with 300 mm wafers in the year 2000. Semiconductor Leading Edge Technologies (Selete) has been evaluating and improving these technologies to complete mass production-type equipment development. The 300 mm fabrication facility plan, equipment development plan and wafer production plan are shown. The evaluation status of some machines is described, along with the issues which must be improved
Keywords :
integrated circuit design; integrated circuit manufacture; integrated circuit technology; manufacturing resources planning; IC mass production; Selete; Semiconductor Leading Edge Technologies; equipment development plan; fabrication facility plan; machine evaluation status; mass production-type equipment development; wafer equipment; wafer materials; wafer production plan; wafer size; Acceleration; Costs; Inspection; Joining materials; Large-scale systems; Lead compounds; Mass production; Productivity; Semiconductor materials; Transportation;
Conference_Titel :
Microelectronic Test Structures, 1998. ICMTS 1998., Proceedings of the 1998 International Conference on
Conference_Location :
Kanazawa
Print_ISBN :
0-7803-4348-4
DOI :
10.1109/ICMTS.1998.688022
