DocumentCode :
2956952
Title :
Flip-Flop Hardening and Selection for Soft Error and Delay Fault Resilience
Author :
Chen, Mingjing ; Orailoglu, Alex
Author_Institution :
CSE Dept., UC San Diego, La Jolla, CA, USA
fYear :
2009
fDate :
7-9 Oct. 2009
Firstpage :
49
Lastpage :
57
Abstract :
The traditional test model of go/no-go testing being questioned by increasing delay fault manifestations has become even further challenged as a result of unpredictable soft errors. Consequent probabilistic fault manifestations shift the focus to fault resilience mechanisms and tradeoffs of false alarms vs. escapes. Fault manifestation at flip-flops necessitates solutions that rely on their hardening, possibly imposing inordinate cost as flip-flops constitute a significant fraction of current designs. A two-pronged approach for resolving this challenge is necessitated, consisting of frugal flip-flop designs, capable of withstanding such faults, and an economic rationalization model to enable a prioritized flip-flop selection within an overall design budget. In this paper, we propose a hardened flip-flop that increases circuit tolerance to soft errors and delay faults simultaneously and the associated selective hardening scheme guided by a unified quality evaluation framework. The proposed flip-flop supersedes previous research efforts and simulation results show that the outlined framework delivers yield recovery and FIT reduction at a minimized hardware cost.
Keywords :
flip-flops; logic design; logic testing; delay fault manifestations; delay fault resilience; economic rationalization model; frugal flip-flop designs; go/no-go testing; probabilistic fault manifestations; soft error; Circuit faults; Circuit testing; Costs; Delay; Fault tolerance; Fault tolerant systems; Flip-flops; Resilience; System testing; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Defect and Fault Tolerance in VLSI Systems, 2009. DFT '09. 24th IEEE International Symposium on
Conference_Location :
Chicago, IL
ISSN :
1550-5774
Print_ISBN :
978-0-7695-3839-6
Type :
conf
DOI :
10.1109/DFT.2009.50
Filename :
5372275
Link To Document :
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