DocumentCode :
2957167
Title :
Dynamic leakage cut-off scheme for low-voltage SRAM´s
Author :
Kawaguchi, H. ; Itaka, Y. ; Sakurai, T.
Author_Institution :
Inst. of Ind. Sci., Tokyo Univ., Japan
fYear :
1998
fDate :
11-13 June 1998
Firstpage :
140
Lastpage :
141
Abstract :
The operation voltage of VLSIs is ever decreasing due to the strong needs for low-power consumption. In order to achieve low-voltage, high-speed operation, the CMOS process tends to be optimized for low-voltage operation using thinner gate oxide and shorter effective channel length. The low-voltage operation is also important in the future VLSIs, where scaled MOSFETs can be operated only in low V/sub DD/ environments with sufficient reliability. Low-voltage SRAM schemes have been proposed, including source voltage driving and dynamic boost of the supply voltage and word line. However, in these schemes the gate voltage of MOSFETs goes up to over 1.4 V even though the V/sub DD/ is 0.8 V, which gives rise to reliability issues in these cases. In this paper, a sub-volt SRAM circuit scheme is presented which speeds up the conventional low-voltage SRAM by more than a factor of two without applying excessive voltage to gate oxide and with maintaining the subthreshold leakage current to a tolerable level.
Keywords :
CMOS memory circuits; SRAM chips; VLSI; leakage currents; 0.15 to 2 V; 0.35 micron; 1 Mbit; CMOS process; dynamic leakage cut-off scheme; high-speed operation; low-power consumption; low-voltage SRAM; operation voltage; reliability; subthreshold leakage current; CMOS process; Circuits; Delay; Dynamic voltage scaling; Isolation technology; MOSFETs; Random access memory; Subthreshold current; Threshold voltage; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Circuits, 1998. Digest of Technical Papers. 1998 Symposium on
Conference_Location :
Honolulu, HI, USA
Print_ISBN :
0-7803-4766-8
Type :
conf
DOI :
10.1109/VLSIC.1998.688035
Filename :
688035
Link To Document :
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