DocumentCode :
2957221
Title :
Effect of strain rate on fatigue of low-tin lead-base solder
Author :
Vaynman, Semyon
Author_Institution :
Basic Ind. Res. Lab., Northwestern Univ., Evanston, IL, USA
fYear :
1989
fDate :
22-24 May 1989
Firstpage :
273
Lastpage :
276
Abstract :
A study of fatigue of low-tin lead-base solder at different strain rates is discussed. The effect of tensile hold time (low strain rate) in reducing the number of cycles to failure was found to be much greater than the effect of ramp time (higher strain rate). While increase up to 1 h time per cycle for no-hold tests did not lead to fatigue life saturation, increase in tensile hold time over a few minutes led to saturation in the number of cycles to failure. Differences in the effects of hold and ramp were attributed to different mechanisms of solder fatigue fracture. It was concluded that fatigue life prediction of solder should be based on tests involving hold time
Keywords :
deformation; fatigue testing; lead alloys; soldering; stress relaxation; tin alloys; PbSn; alloys; cycles to failure; fatigue life saturation; hold time; low-tin lead-base solder; materials testing; no-hold tests; ramp time; solder fatigue fracture; strain rate; tensile hold time; Capacitive sensors; Failure analysis; Fatigue; Frequency; Lead; Life testing; Soldering; Temperature; Tensile strain; Tensile stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components Conference, 1989. Proceedings., 39th
Conference_Location :
Houston, TX
Type :
conf
DOI :
10.1109/ECC.1989.77761
Filename :
77761
Link To Document :
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