DocumentCode :
2957301
Title :
Mechanical test assessment for electronic modules able to function in harsh conditions
Author :
Plotog, Ioan ; Varzaru, Gaudentiu ; Svasta, Paul
Author_Institution :
Centre for Electron. Technol. & Interconnection Tech., Politeh. Univ. from Bucharest, Bucharest, Romania
fYear :
2010
fDate :
16-18 Sept. 2010
Firstpage :
355
Lastpage :
358
Abstract :
The transition from through-hole technology to surface mount technology has increased the requirement for the reliability of the solder joint shear strength. The transition from lead to lead-free technology had issued new materials, but the most used alloy (SAC) offers an weaker shear strength to the solder joints than SnPb. The solder joints cannot fulfill the electrical and thermal functions if the mechanical function fails. The present paper focuses on some mechanical properties of the lead free solder joints, which have influence on joint reliability, as consequences of the process parameters and pad finishes.
Keywords :
copper alloys; mechanical testing; reliability; shear strength; silver alloys; solders; surface mount technology; tin alloys; SnAgCu; electronic modules; harsh conditions; joint reliability; lead free solder joints; mechanical test assessment; pad finishes; process parameters; solder joint shear strength; surface mount technology; through-hole technology; Cooling; Force; Intermetallic; Lead; Reliability; Soldering; mechanical functionality; shear strength; solder joint;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical and Electronics Engineering (ISEEE), 2010 3rd International Symposium on
Conference_Location :
Galati
Print_ISBN :
978-1-4244-8406-5
Type :
conf
DOI :
10.1109/ISEEE.2010.5628466
Filename :
5628466
Link To Document :
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