Title :
Distributed RLC Interconnect: Analytical Modelling Expressions for Crosstalk Noise Estimation
Author :
Kadim, H.J. ; Coulibaly, L.M.
Author_Institution :
Liverpool JM Univ., Liverpool
Abstract :
As the chip dimensions increase with chip complexity, interconnects tend to get longer. With the longer on-chip interconnects coupled with a decrease in wire width and wire separation, inductive coupling effects have become non-negligible. Analytical modelling expressions for the estimation of the noise peak voltage of the victim line under worst-case crosstalk noise effect are presented.
Keywords :
RLC circuits; crosstalk; integrated circuit interconnections; integrated circuit modelling; integrated circuit noise; IC interconnections; crosstalk noise estimation; distributed RLC interconnect; inductive coupling effects; noise peak voltage; worst case crosstalk noise effect; Analytical models; Circuit optimization; Crosstalk; Delay effects; Delay estimation; Function approximation; Integrated circuit interconnections; Transfer functions; Very large scale integration; Wire;
Conference_Titel :
Electronics, Circuits and Systems, 2006. ICECS '06. 13th IEEE International Conference on
Conference_Location :
Nice
Print_ISBN :
1-4244-0395-2
Electronic_ISBN :
1-4244-0395-2
DOI :
10.1109/ICECS.2006.379666
