Title :
1988 Proceedings. Fifth International IEEE VLSI Multilevel Interconnection Conference (Cat. No.88CH2624-5)
Abstract :
The following topics are dealt with: VLSI multiconnection; complete process realization; planarization processes; conductor systems; refractory conductor systems; test structures and parasitics/modeling; dielectric systems; contact and via fill systems; and reliability issues. Abstracts of individual papers can be found under the relevant classification codes in this or other issues
Keywords :
VLSI; integrated circuit technology; metallisation; VLSI multiconnection; conductor systems; contact systems; dielectric systems; metallisation; modelling; multilevel interconnection; parasitics; planarization processes; refractory conductor systems; reliability; test structures; via fill systems;
Conference_Titel :
VLSI Multilevel Interconnection Conference, 1988. Proceedings., Fifth International IEEE
Conference_Location :
Santa Clara, CA, USA
DOI :
10.1109/VMIC.1988.14169
