DocumentCode :
2958481
Title :
Thermal analysis of the microscale pyroelectric thin film infrared detector
Author :
Dong, Zheng ; Huang, Da-Gui ; Zhang, De-Yin
Author_Institution :
Sch. of Mechatron. Eng., Univ. of Electron. Sci. & Technol. of China, Chengdu
fYear :
2008
fDate :
5-8 Aug. 2008
Firstpage :
49
Lastpage :
54
Abstract :
A new numerical solution based on exponential fitting and Newton interpolation for solving the one-dimensional hyperbolic heat conduction in the microscale pyroelectric thin film sensing element is investigated in this paper. The high precision and calculation validity can be achieved by employing the five order explicit schemes of our new solution. Results have been obtained using the new solution for the dimensional temperature and current distribution, the thermal propagation process, amplitude and shape of thermal waves under the boundary conditions of step temperature change and modulated heat flux. The calculated results of the relation between dimensional current response and frequency are directly obtained from the data of the heat propagation using the actual parameters of the LiTaO3 material and indicate that the material of LiTaO3 is specially fit for fire alarm detector working at the very low frequency near to 1 Hz.
Keywords :
infrared detectors; interpolation; lithium compounds; pyroelectric detectors; thermal analysis; LiTaO3; Newton interpolation; exponential fitting; fire alarm detector; hyperbolic heat conduction; infrared detector; microscale pyroelectric thin film; thermal analysis; Boundary conditions; Current distribution; Frequency; Infrared detectors; Interpolation; Pyroelectricity; Shape; Temperature distribution; Temperature sensors; Transistors; Exponential fitting; Heat conduction; LiTaO3; Pyroelectric detector; Thin film;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Mechatronics and Automation, 2008. ICMA 2008. IEEE International Conference on
Conference_Location :
Takamatsu
Print_ISBN :
978-1-4244-2631-7
Electronic_ISBN :
978-1-4244-2632-4
Type :
conf
DOI :
10.1109/ICMA.2008.4798724
Filename :
4798724
Link To Document :
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