Title :
A Bluetooth-Smart Insulating Container for Cold-Chain Logistics
Author :
Chou, Pai H. ; Cheng-Ting Lee ; Zan-Ya Peng ; Jo-Ping Li ; Tong Kun Lai ; Chun-Min Chang ; Cheng-Hsun Yang ; Yi-Lin Chen ; Chin-Chung Nien ; Li-Huei Chen ; Li-Yen Lai ; Jen-Chao Lu ; Shang-Chih Hung
Author_Institution :
Dept. of EECS, UC Irvine, Irvine, CA, USA
Abstract :
This paper describes an intelligent insulating shipping container (IISC) and the supporting backend for cold-chain logistics. Each IISC can monitor the interior temperature of the container during shipping of temperature-sensitive items and alerts the deliverer wirelessly via a Bluetooth-Smart (also called Bluetooth 4.0 Low Energy, BLE) connection on their smartmobile without infrastructure or dongle. The smartmobile also serves as a BLE-tag reader, user interface, and communication uplink for shipment tracking. BLE enables the IISCs to be wakable on demand within a short latency while lasting for six months to a year on each battery charge. When integrated into cold-chain logistics, our IISCs are expected to not only reduce the amount of goods spoiled during shipping but also improve fuel efficiency of fleets by enabling effective use of passive cooling elements.
Keywords :
Bluetooth; battery management systems; cold storage; freight containers; goods distribution; logistics; low-power electronics; smart phones; thermal insulation; BLE connection; BLE-tag reader; Bluetooth 4.0 low energy connection; IISC; battery charge; bluetooth-smart insulating container; cold-chain logistics; communication uplink; dongle; fuel efficiency; intelligent insulating shipping container; interior temperature; passive cooling element; shipment tracking; smartmobile; temperature-sensitive items; user interface; Batteries; Containers; Logistics; Servers; Temperature measurement; Temperature sensors; Vehicles; Bluetooth Smart; cold-chain logistics; insulating shipping container; smartmobile; temperature monitoring;
Conference_Titel :
Service-Oriented Computing and Applications (SOCA), 2013 IEEE 6th International Conference on
Conference_Location :
Koloa, HI
Print_ISBN :
978-1-4799-2701-2
DOI :
10.1109/SOCA.2013.46