Fiber optic modules for high speed computer networks

Author

Crow, John D.

Author_Institution

IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA

fYear

1989

fDate

22-24 May 1989

Firstpage

355

Lastpage

358

Abstract

Optical networks for high-performance processors will benefit from an optoelectronic integrated circuit (OEIC) technology with high speed, high circuit density, and low power consumption. These chips should be packaged in small, card-mountable modules, compatible with arrays of fiber-optic lines. Fiber-optic technology options for this application are discussed. Results are presented for transmitter and receiver modules containing OEICs with 6-10 K transistors per chip, 1-Gb/s performance, and 400-800 mW per chip heat generation. The modules are fabricated using GaAs MESFET technology and GaAlAs quantum-well-laser arrays and packaged using multilayered polyimide/metal/Si carriers

Keywords

III-V semiconductors; aluminium compounds; computer networks; field effect integrated circuits; gallium arsenide; integrated optoelectronics; optical fibres; optical links; semiconductor junction lasers; semiconductor quantum wells; 1 Gbit/s; 400 to 800 mW; GaAlAs; GaAs; MESFET technology; card-mountable modules; circuit density; fiber-optic lines; heat generation; high speed computer networks; high-performance processors; optoelectronic integrated circuit; power consumption; quantum-well-laser arrays; receiver; transmitter; Application software; Computer networks; Energy consumption; High speed integrated circuits; Integrated circuit packaging; Integrated circuit technology; Optical fiber networks; Optical fibers; Optoelectronic devices; Photonic integrated circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components Conference, 1989. Proceedings., 39th

Conference_Location

Houston, TX

Type

conf

DOI

10.1109/ECC.1989.77771

Filename

77771