DocumentCode
2958918
Title
Study on shear stress measurement with LCR wave from surface based on LFMCW
Author
Dai, Xianjin ; Ding, Jiexiong ; Liang, Yinglin ; Bai, Zhijin ; Kong, Chaozhi
Author_Institution
Sch. of Mechatron. Eng. Dept., Univ. of Electron. Sci. & Technol. of China, Chengdu
fYear
2008
fDate
5-8 Aug. 2008
Firstpage
197
Lastpage
202
Abstract
The critically refracted longitudinal (LCR) wave, which is a bulk longitudinal mode that travels within an effective depth underneath the surface, suits to be used to detect both surface stress and body stress. Strain inside the object would change the propagation velocity of the LCR wave in the direction of the stress field. But in fact the alteration of the travel time of LCR wave is so negligible that it´s difficult to measure. Usually, the pulse wave is used to drive LCR wave, which may lead two difficulties. One is how to guarantee the power of the transmitting waves, the other is how to separate the LCR wave from the receiving waves which contains many other common-frequency waves. In this paper, a special way for driving the LCR wave which is called linear frequency modulated continuous wave (LFMCW) is discussed, which could overcome the problems mentioned above. And a method for the shear stress measurement with LCR wave based on LFMCW is also introduced. The simulation of the system turns out that the method could provide high accurate for the measurement of shear stress with LCR wave.
Keywords
elastic waves; nondestructive testing; shear strength; stress measurement; structural engineering; ultrasonic applications; ultrasonic propagation; LCR wave propagation; critically refracted longitudinal wave; engineering structure analysis; linear frequency modulated continuous wave; nondestructive testing; shear stress measurement; Aerospace industry; Chaotic communication; Chirp modulation; Chromium; Frequency modulation; Mechatronics; Pulse measurements; Stress measurement; Surface waves; Time measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Mechatronics and Automation, 2008. ICMA 2008. IEEE International Conference on
Conference_Location
Takamatsu
Print_ISBN
978-1-4244-2631-7
Electronic_ISBN
978-1-4244-2632-4
Type
conf
DOI
10.1109/ICMA.2008.4798751
Filename
4798751
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