Author :
Thompson-Bell, Ian
Author_Institution :
Technology Partnership, Melbourn, UK
Abstract :
The use of bare silicon die on thick film and PCB substrates has been commonplace for many years. Devices of ever increasing size and complexity have benefited from the reduced cost and size associated with the absence of device packages. However, one area where these benefits have not been realised is with optical devices and in particular with imaging devices. This paper describes the work undertaken by The Technology Partnership in the development of a very low cost imager which is mounted directly upon a PCB substrate
Keywords :
CMOS image sensors; chip-on-board packaging; integrated circuit packaging; integrated circuit testing; integrated circuit yield; microassembling; CMOS imagers; PCB substrate; PCB substrates; bare die imager; bare silicon die; device complexity; device cost; device packages; device size; direct mounted imager; imager cost; imager development; imaging devices; optical devices; thick film substrates; Aerospace industry; Charge coupled devices; Costs; Manufacturing; Microcontrollers; Packaging; Semiconductor device noise; Silicon; Substrates; Thick films;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 2000. Twenty-Sixth IEEE/CPMT International
Conference_Location :
Santa Clara, CA
Print_ISBN :
0-7803-6482-1
DOI :
10.1109/IEMT.2000.910705
